XC-3100 is a new type of X-ray spotting machine, used to quickly count the reel materials in the SMT industry, with an accuracy of 99.99% and a four-reel inspection speed of only 7-14S.
XC-3100 is a new type of X-ray spotting machine, used to quickly count the reel materials in the SMT industry, with an accuracy of 99.99% and a four-reel inspection speed of only 7-14S.
The X-7900 electronic semiconductor inspection equipment can be used to detect integrated circuit chip semiconductors with high precision testing, such as BGA, IGBT, flip chip and PCBA module welding, LED, photovoltaic etc.; Widely used in industrial manufacturing field, such as automobile parts, casting testing, quality testing for pressure vessel and pipe welding; Can detect defects of various types of battery, such as power battery, cylinder, soft packaging, square battery and laminated board.
The X-7900 electronic semiconductor inspection equipment can be used to detect integrated circuit chip semiconductors with high precision testing, such as BGA, IGBT, flip chip and PCBA module welding, LED, photovoltaic etc.; Widely used in industrial manufacturing field, such as automobile parts, casting testing, quality testing for pressure vessel and pipe welding; Can detect defects of various types of battery, such as power battery, cylinder, soft packaging, square battery and laminated board.
X-7100 X-RAY has a wide range of inspection fields and is usually used in the internal structure inspection of electronic components. Common bubble void rate measurement, circuit short circuit and open circuit, solder joint lack of solder, less solder leakage, and foreign body cracks inside.....
X-7100 X-RAY has a wide range of inspection fields and is usually used in the internal structure inspection of electronic components. Common bubble void rate measurement, circuit short circuit and open circuit, solder joint lack of solder, less solder leakage, and foreign body cracks inside.....
X-9200K electronic semiconductor inspection equipment, the minimum inspection accuracy of 0.6um, can be used to detect integrated circuit chip semiconductor, such as BGA, IGBT, inverted chip and PCBA component welding, LED bonding, IC packaging with high precision testing.
X-9200K electronic semiconductor inspection equipment, the minimum inspection accuracy of 0.6um, can be used to detect integrated circuit chip semiconductor, such as BGA, IGBT, inverted chip and PCBA component welding, LED bonding, IC packaging with high precision testing.
X-9200's large-size stage (1700*1000mm) can accommodate a variety of large-size samples for X-RAY testing. Its feature of being suitable for large-volume automatic testing is deeply loved by customers and is widely used in LED hard light bar testing.
X-9200's large-size stage (1700*1000mm) can accommodate a variety of large-size samples for X-RAY testing. Its feature of being suitable for large-volume automatic testing is deeply loved by customers and is widely used in LED hard light bar testing.
X-9200A can be applied to the inspection of aluminum castings, with a detection accuracy of 5um, geometric magnification of 400X, and system magnification of 2500X, which can better detect high-precision aluminum castings.
X-9200A can be applied to the inspection of aluminum castings, with a detection accuracy of 5um, geometric magnification of 400X, and system magnification of 2500X, which can better detect high-precision aluminum castings.
