• Universal X-RAY
    Universal X-RAY
    Ultra-high precision X-RAY_X-9200S
    Ultra-high precision X-RAY_X-9200S
    Stage size:550*500mm Spatial resolution:0.98um Optical magnification:800x Scope of application:Ultra-high precision components Tube voltage:

    The open X-RAY light tube provides higher detection accuracy for X-9200S. The detection image can be geometrically magnified by 800x and the system magnified by 2500x, which is suitable for users with high requirements for X-RAY detection accuracy.

    specification
    Model:X-9200S
    X-Ray tube typeOpen
    Spatial resolutiaon0.98um
    Light tube voltage110KV
    Light tube current200uA
    MagnificationGeometric magnification 800, system magnification 2500X
    Digital flat panel detector resolution1536*1536 px
    Digital flat panel detector density value14bit (16348)
    Image speed22 (FPS)
    Support rotation angle75°
    Stage size550*500mm
    Detection speed360° (Optional)
    X-Y strokee1450*800mm
    Examination range0.02-8cm2
    Machine size1250*1635*1885 mm (L*W*H)
    Machine weight1690KG
    operating systemWINDOWS 7/WINDOWS 10
    Power supply/powerAC110-220V  50-60HZ 1200W
    Radiation safety test<1 uSV/H
    XC-3100 is a new type of X-ray spotting machine, used to quickly count the reel materials in the SMT industry, with an accuracy of 99.99% and a four-reel inspection speed of only 7-14S.
    The X-7900 electronic semiconductor inspection equipment can be used to detect integrated circuit chip semiconductors with high precision testing, such as BGA, IGBT, flip chip and PCBA module welding, LED, photovoltaic etc.; Widely used in industrial manufacturing field, such as automobile parts, casting testing, quality testing for pressure vessel and pipe welding; Can detect defects of various types of battery, such as power battery, cylinder, soft packaging, square battery and laminated board.
    X-7100 X-RAY has a wide range of inspection fields and is usually used in the internal structure inspection of electronic components. Common bubble void rate measurement, circuit short circuit and open circuit, solder joint lack of solder, less solder leakage, and foreign body cracks inside.....
    188-2319-2896
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